Siegel modular forms of degree two and level five
Wang, Haowu; Williams, Brandon (Corresponding author)
Dordrecht [u.a.] : Springer Science + Business Media B.V (2022)
Fachzeitschriftenartikel
In: The Ramanujan journal
Identifikationsnummern
- DOI: 10.1007/s11139-022-00614-z
- DOI: 10.18154/RWTH-2022-08518
- RWTH PUBLICATIONS: RWTH-2022-08518